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Condensate Polishing

Condensate Polishing is a specialty application where ion exchange resins are used for removal of corrosion transport products as well as removal of trace ionic impurities. This requires the use of resins that have excellent filtration characteristics as well as ion exchange capacity, and that can withstand the high temperatures and flow rates encountered in condensate systems.

Polishing resins must also have low levels of both organic and ionic impurities such that they do not leach any objectionable contaminants into the treated water.

ResinTech offers a variety of coarse grade and uniform particle size resins specifically for condensate polishing, including highly crosslinked resins with excellent thermal stability. These resins are available in a variety of ionic forms such as ammonia and amine forms for cation resin and hydroxide form for anion resin, suitable for immediate use without preconditioning or regeneration.

All of ResinTechs condensate polishing resins are available in uniform particle size (UPS) as well as Gaussian size distributions.


CG8-H-BLBlack colored high capacity highly regenerated, low sodium hydrogen form cation resin.
CG8-H-BL-UPSBlack colored uniform particle size high capacity highly regenerated, low sodium hydrogen form cation resin.
CG10-H-BLBlack colored high crosslinked highly regenerated, low sodium hydrogen form cation resin.
CG10-H-BL-UPSBlack colored uniform particle size high crosslinked highly regenerated, low sodium hydrogen form cation resin.
SBG1P-OHHydroxide form type I porous anion resin with low chloride residual and lowest possible TOC.
SACMP-HMacroporous high crosslinked highly regenerated, low sodium hydrogen form cation resin.
SACMP-H-UPSMacroporous uniform particle size high crosslinked highly regenerated, low sodium hydrogen form cation resin.
SBG1P-OH-UPSHydroxide form uniform particle size type I porous anion resin with low chloride residual and lowest possible TOC.
SBG1-OHHydroxide form type I high crosslinked anion resin with low chloride residual and lowest possible TOC.
SBG1-OH-UPSHydroxide form uniform particle size type I high crosslinked anion resin with low chloride residual and lowest possible TOC.
SBMP1-OHHydroxide form type I macroporous high crosslinked anion resin with low chloride residual and lowest possible TOC.
SBMP1-OH-UPSHydroxide form uniform particle size type I macroporous high crosslinked anion resin with low chloride residual and lowest possible TOC.
MBD-101:1 equivalent mixture of CG8-H-BL and SBG1-OH.  Highest capacity lowest TOC mixed bed intended for final polishing in secondary loops.
MBD-10-UPS1:1 equivalent mixture of CG8-H-BL-UPS and SBG1-OH-UPS.  Highest capacity lowest TOC uniform particle size mixed bed intended for final polishing in secondary loops.
MBD-151:1 equivalent mixture of CG8-H-BL and SBG1P-OH.  High capacity low TOC mixed bed intended for use in primary loops that are frequently regenerated.
MBD-15-UPS1:1 equivalent mixture of CG8-H-BL-UPS and SBG1P-OH-UPS.  High capacity low TOC uniform particle size mixed bed intended for use in primary loops that are frequently regenerated.
MBD-10-NSSpecial non separating mixed bed for use where it is not possible to remix resin before use. (Call For Specifications)
IT-1Special inert polymer beads intended for tri bed systems as a buffer between cation and anion resin layers during regeneration.
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